Mask assembly for testing a deposition process, deposition apparatus including the mask assembly, and testing method for a deposition process using the mask assembly

ABSTRACT

A deposition apparatus includes deposition sources, a deposition chamber, a mask assembly, and a transfer unit. The mask assembly includes a support member, a shutter member, and a drive member. The support member has a first opening configured to allow the deposition materials to pass through while supporting the base substrate on which the passed-through deposition materials are deposited. The shutter member is accommodated in the support member and has a second opening smaller than the first opening. The drive member is configured to change a position of the second opening with respect to the base substrate in accordance with the movement of the mask assembly.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims priority to and the benefit of Korean PatentApplication No. 10-2012-0097799, filed on Sep. 4, 2012 in the KoreanIntellectual Property Office, the entire content of which is herebyincorporated by reference.

BACKGROUND

1. Field

Aspects of embodiments of the present invention relate to a maskassembly for testing a deposition process, a deposition apparatusincluding the mask assembly, and a testing method for a depositionprocess using the mask assembly.

2. Description of Related Art

A flat panel display or a semiconductor device may be manufactured bydepositing organic or inorganic materials on a base substrate. To thisend, a deposition process may be performed in a deposition apparatus.The deposition apparatus may include a vacuum chamber, at least onedeposition source in the vacuum chamber, a mask, and a transfer unitthat transfers the base substrate. A testing of the deposition processmay be performed to assess whether the deposition process (as performedin the deposition apparatus) is appropriate before performing thedeposition process to manufacture the flat panel display or thesemiconductor device. A test substrate may be used to test thedeposition process. For example, the thickness and uniformity of thedeposited material may be measured on the test substrate as part of thetesting of the deposition process. To this end, the measured thicknessand uniformity may be compared to a reference thickness and uniformity.

When testing the deposition process for a deposition apparatus havingmultiple deposition sources, each for depositing a different material,multiple test substrates may be needed. For example, the test substratesmay be sequentially loaded into the deposition apparatus and thedifferent materials respectively deposited on the different testsubstrates. The thickness and uniformity of each of the depositionmaterials deposited on the respective test substrates may then bemeasured.

SUMMARY

Embodiments of the present invention provide for a mask assembly capableof testing a deposition process using one test substrate for a pluralityof deposition sources. Further embodiments provide for a depositionapparatus including the mask assembly, and for a testing method for adeposition process using the mask assembly.

According to an exemplary embodiment of the present invention, a maskassembly for testing a deposition process is provided. The mask assemblyincludes a support member having a first opening configured to allowdeposition materials to pass through while supporting a base substrateon which the passed-through deposition materials are deposited while themask assembly moves in a first direction, a shutter member accommodatedin the support member and having a second opening smaller than the firstopening, and a drive member configured to move the shutter member inaccordance with the movement of the mask assembly to change a positionof the second opening with respect to the base substrate.

The support member may include a bottom portion having the firstopening, and a sidewall bent from the bottom portion to support the basesubstrate.

The shutter member may be configured to move with respect to the basesubstrate in a direction opposite to the first direction in accordancewith the movement of the mask assembly.

The second opening may extend in a second direction substantiallyperpendicular to the first direction.

The shutter member may have a larger area than the first opening and maybe located on the bottom portion.

The mask assembly may further include a rail unit located on the bottomportion, and a coupling unit coupled to the shutter member and insertedinto the rail unit to allow the shutter member to move along the railunit.

The drive member may be configured to rotate in accordance with themovement of the mask assembly. The shutter member may be configured tomove in accordance with the rotation of the drive member.

The drive member may include a first pinion configured to rotate by africtional force.

The drive member may further include a second pinion configured toreceive a motive power from the first pinion and to make contact with aside surface of the shutter member.

The shutter member may include sawteeth on the side surface of theshutter member and configured to engage sawteeth of the second pinion.

The drive member may include an N-polar portion and an S-polar portionthat are alternately arranged, and may be configured to rotate by amagnetic force.

According to another exemplary embodiment of the present invention, amask assembly for testing a deposition process is provided. The maskassembly includes a support member having a first opening configured topass through deposition materials while supporting a base substrate onwhich the passed-through deposition materials are deposited while themask assembly moves, a shutter member accommodated in the support memberand including a rotatable member having a second opening smaller thanthe first opening, and a drive member configured to rotate the rotatablemember in accordance with the movement of the mask assembly to change aposition of the second opening with respect to the base substrate.

The support member may include a bottom portion having the firstopening, and a sidewall bent from the bottom portion to support the basesubstrate.

The shutter member may further include a rotation axis coupled to therotatable member to rotate the rotatable member.

The first opening may include a left first opening and a right firstopening. The shutter member may include a left shutter memberoverlapping the left first opening and a right shutter memberoverlapping the right first opening.

The drive member may include a first drive member configured to rotatein a first direction and a second drive member configured to rotate in asecond direction that is opposite to the first direction in accordance,with the movement of the support member. The position of the secondopening of the rotatable member of the left shutter member with respectto the base substrate may be configured to change by the rotation of thefirst drive member. The position of the second opening of the rotatablemember of the right shutter member with respect to the base substratemay be configured to change by the rotation of the second drive member.

Each of the first drive member and the second drive member may include afirst pinion configured to rotate by a frictional force.

Each of the first and second drive members may further include a secondpinion configured to receive a motive power from the first pinion and tomake contact with a side surface of the shutter member.

Each of the first and second drive members may include a discus-shapedmagnetic member including an N-polar portion and an S-polar portion thatare alternately arranged. The magnetic member may be configured torotate by a magnetic force.

According to yet another exemplary embodiment of the present invention,a deposition apparatus is provided. The deposition apparatus includes: aplurality of deposition sources configured to deposit depositionmaterials; a deposition chamber accommodating the deposition sources; amask assembly for testing a deposition process, the mask assembly beingconfigured to couple to a base substrate while moving through thedeposition chamber while the deposition sources deposit the depositionmaterials on the base substrate; and a transfer unit configured to movethe mask assembly through the deposition chamber. The mask assemblyincludes a support member having a first opening configured to allow thedeposition materials to pass through while supporting the base substrateon which the passed-through deposition materials are deposited, ashutter member accommodated in the support member and having a secondopening smaller than the first opening, and a drive member configured tochange a position of the second opening with respect to the basesubstrate in accordance with the movement of the mask assembly.

The transfer unit may include a plurality of rollers configured to movethe mask assembly through the deposition chamber.

The drive member may be configured to rotate in accordance with themovement of the mask assembly. The position of the second opening may beconfigured to change by the rotation of the drive member.

The deposition chamber may include a loading area configured to couplethe base substrate to the mask assembly, a deposition area in which thedeposition sources are accommodated, and an unloading area configured todecouple the base substrate from the mask assembly.

The drive member may include a plurality of pinions. One of the pinionsmay be configured to contact a side surface of the shutter member tochange the position of the second opening with respect to the basesubstrate.

The deposition chamber may include a plurality of transfer racks on asidewall of the deposition area to correspond to the deposition sourcesor to spaces between the deposition sources.

Another one of the pinions may be configured to contact the transferracks to change the position of the second opening with respect to thebase substrate.

The deposition apparatus may further include a return unit configured toreturn the mask assembly to the loading area from the unloading area,and a return chamber accommodating the return unit.

The return chamber may include a return rack on a sidewall of the returnchamber.

The drive member may include a discus-shaped magnetic member includingan N-polar portion and an S-polar portion that are alternately arranged.The deposition chamber may include a plurality of magnetic transfermembers, each including an N-polar portion and an S-polar portion thatare alternately arranged, on a sidewall of the deposition area tocorrespond to the deposition sources.

The support member may include a bottom portion having the firstopening, and a sidewall bent from the bottom portion to support the basesubstrate.

The shutter member may be configured to move with respect to the basesubstrate in a direction opposite to a direction in which the maskassembly moves, in accordance with the movement of the mask assembly.

The shutter member may include a rotatable member configured to rotateby the movement of the mask assembly.

According to still yet another exemplary embodiment of the presentinvention, a testing method for a deposition process using a maskassembly is provided. The testing method includes: entering the maskassembly into a deposition area of a deposition chamber accommodating aplurality of deposition sources, the mask assembly including a supportmember supporting a base substrate and a shutter member having anopening; depositing a respective plurality of deposition materials fromthe plurality of deposition sources onto the base substrate; moving themask assembly through the deposition area; and changing a position ofthe opening of the shutter member with respect to the base substrate inaccordance with the movement of the mask assembly.

The testing method may further include: exiting the mask assembly fromthe deposition area, and returning the mask assembly to an entrance ofthe deposition area from an exit of the deposition area.

The changing of the position of the opening of the shutter member mayinclude moving the shutter member with respect to the base substrate ina direction opposite to a direction in which the mask assembly moves.

The changing of the position of the opening of the shutter member mayinclude rotating the shutter member in accordance with the movement ofthe mask assembly.

The plurality of deposition materials may include a correspondingplurality of different deposition materials.

According to the above and other embodiments, the mask assembly uses onetest substrate to test the deposition process of the depositionapparatus having multiple deposition sources supplying a correspondingmultiple deposition materials. The mask assembly receives the respectivedeposition materials in different areas of the test substrate. Since thenumber of test substrates needed to test the deposition process may bereduced, testing costs may be reduced and the time needed to test thedeposition process may be shortened.

According to the above and other embodiments, in the depositionapparatus, the position of the second opening of the shutter member withrespect to the test substrate is changed in accordance with the movementof the mask assembly. The position of the second opening is changed foreach deposition source. Thus, the deposition materials are deposited indifferent areas of the test substrate.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other aspects and features of the present invention willbecome readily apparent by reference to the following detaileddescription when considered in conjunction with the accompanyingdrawings wherein:

FIG. 1 is a plan view showing a deposition apparatus according to anexemplary embodiment of the present invention;

FIG. 2 is a first cross-sectional view showing a portion of thedeposition apparatus shown in FIG. 1 according to an exemplaryembodiment of the present invention;

FIG. 3 is a second cross-sectional view showing a portion of thedeposition apparatus shown in FIGS. 1-2;

FIG. 4A is a perspective view showing a mask assembly used to test adeposition process according to an exemplary embodiment of the presentinvention;

FIG. 4B is an exploded perspective view showing the mask assembly ofFIG. 4A;

FIG. 5A is a perspective view showing a mask assembly used to test adeposition process according to another exemplary embodiment of thepresent invention;

FIG. 5B is an exploded perspective view showing the mask assembly ofFIG. 5A;

FIG. 6A is a perspective view showing a mask assembly used to test adeposition process according to yet another exemplary embodiment of thepresent invention;

FIG. 6B is an exploded perspective view showing the mask assembly ofFIG. 6A;

FIG. 7 is a first cross-sectional view showing a portion of thedeposition apparatus shown in FIG. 1 according to another exemplaryembodiment of the present invention;

FIG. 8 is a second cross-sectional view showing a portion of thedeposition apparatus shown in FIGS. 1 and 7;

FIG. 9 is a perspective view showing a portion of the depositionapparatus of FIGS. 1 and 7-8 according to an exemplary embodiment of thepresent invention;

FIG. 10 is a perspective view showing a portion of the depositionapparatus of FIGS. 1 and 7-8 according to another exemplary embodimentof the present invention;

FIG. 11 is an enlarged perspective view showing a portion of thedeposition apparatus shown in FIG. 10;

FIG. 12 is a plan view showing a deposition apparatus according toanother exemplary embodiment of the present invention;

FIG. 13 is a first cross-sectional view showing a portion of thedeposition apparatus shown in FIG. 12; and

FIG. 14 is a second cross-sectional view showing a portion of thedeposition apparatus shown in FIGS. 12-13.

DETAILED DESCRIPTION

It will be understood that when an element or layer is referred to asbeing “on,” “connected to,” or “coupled to” another element or layer, itcan be directly on, connected to, or coupled to the other element, orone or more intervening elements or layers may be present. In contrast,when an element is referred to as being “directly on,” “directlyconnected to,” or “directly coupled to” another element or layer, thereare no intervening elements or layers present. Like numbers refer tolike elements throughout. As used herein, the term “and/or” includes anyand all combinations of one or more of the associated listed items.

It will be understood that, although the terms first, second, etc., maybe used herein to describe various elements, components, regions,layers, and/or sections, these elements, components, regions, layers,and/or sections should not be limited by these terms. These terms areonly used to distinguish one element, component, region, layer, orsection from another element, component, region, layer, or section.Thus, a first element, component, region, layer, or section discussedbelow could be termed a second element, component, region, layer, orsection without departing from the teachings of the present invention.

Spatially relative terms, such as “beneath,” “below,” “lower,” “above,”“upper,” and the like, may be used herein for ease of description todescribe one element or feature's relationship to another element(s) orfeature(s) as illustrated in the figures. It will be understood that thespatially relative terms are intended to encompass differentorientations of the device in use or operation in addition to theorientation depicted in the figures. For example, if the device in thefigures is turned over, elements described as “below” or “beneath” otherelements or features would then be oriented “above” the other elementsor features. Thus, the exemplary term “below” can encompass both anorientation of above and below. The device may be otherwise oriented(rotated 90 degrees or at other orientations) and the spatially relativedescriptors used herein interpreted accordingly.

The terminology used herein is for the purpose of describing particularembodiments only and is not intended to be limiting of the invention. Asused herein, the singular forms, “a”, “an,” and “the” are intended toinclude the plural forms as well, unless the context clearly indicatesotherwise. It will be further understood that the terms “includes,”“comprises,” “comprising,” and/or “including,” when used in thisspecification, specify the presence of stated features, integers, steps,operations, elements, and/or components, but do not preclude thepresence or addition of one or more other features, integers, steps,operations, elements, components, and/or groups thereof.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which this invention belongs. It will befurther understood that terms, such as those defined in commonly useddictionaries, should be interpreted as having a meaning that isconsistent with their meaning in the context of the relevant art andwill not be interpreted in an idealized or overly formal sense unlessexpressly so defined herein. Hereinafter, the present invention will beexplained in detail with reference to the accompanying drawings.

FIG. 1 is a plan view showing a deposition apparatus according to anexemplary embodiment of the present invention. FIG. 2 is a firstcross-sectional view showing a portion of the deposition apparatus shownin FIG. 1 according to an exemplary embodiment of the present invention.FIG. 3 is a second cross-sectional view showing a portion of thedeposition apparatus shown in FIGS. 1-2.

Referring to FIGS. 1 to 3, a deposition apparatus includes a depositionchamber CB, a plurality of deposition sources S1 to S4, a mask assemblyMA for testing a deposition process, and a transfer unit TP. FIGS. 1 to3 show four deposition sources S1 to S4 as an example.

The deposition chamber CB has a shape elongated in a first direction D1in which a deposition process is performed. The deposition chamber CBincludes a first sidewall SW1, a second sidewall SW2 facing the firstsidewall SW1 in a second direction D2 substantially perpendicular to thefirst direction D1, a bottom portion BP connected between the firstsidewall SW1 and the second sidewall SW2, and a ceiling portion CP. Thebottom portion BP faces the ceiling portion CP in a third direction D3substantially perpendicular to the first direction D1 and the seconddirection D2.

The deposition chamber CB is divided into a plurality of areas accordingto functions. The deposition chamber CB includes a loading area 100, adeposition area 200, and an unloading area 300.

A base substrate SUB is loaded onto or coupled to the mask assembly MAin the loading area 100. The base substrate SUB may be a test substratefor testing whether a deposition process is appropriate to manufacture adisplay panel or other semiconductor device before the display panel orsemiconductor device is manufactured using the deposition process. Asubstrate intended for manufacturing the display panel or semiconductordevice may be used as the base substrate SUB. For instance, thesubstrate may be for a display panel that may be for, but not limitedto, an organic light emitting diode display panel. The base substrateSUB may include, for example, glass, silicon, metal, or plastic.

The deposition sources S1 to S4 are disposed (for example, accommodated)in the deposition area 200. The deposition sources S1 to S4 are spacedapart from each other along the first direction D1. In otherembodiments, the number and arrangement of deposition sources may varyfrom those shown in FIGS. 1-3.

The deposition sources 81 to S4 may respectively provide differentdeposition materials M1 to M4. The deposition sources S1 to S4 may, forexample, provide organic materials and/or inorganic materials. Each ofthe deposition sources S1 to S4 may include a container to accommodatethe respective deposition materials M1 to M4 and a heating unit toevaporate the deposition materials M1 to M4.

The deposition area 200 is divided into a plurality of individualdeposition areas 210 to 240. The deposition sources S1 to S4 arerespectively accommodated in the individual deposition areas 210 to 240.The individual deposition areas 210 to 240 are partitioned by aplurality of partition walls B1 to B3.

The base substrate SUB is unloaded or decoupled from the mask assemblyMA in the unloading area 300. Doors may be installed between the loadingarea 100 and the deposition area 200 (for example, at an entrance of thedeposition area) and between the deposition area 200 and the unloadingarea 300 (for example, at an exit of the deposition area). In addition,pressures in the loading area 100, the deposition area 200, and theunloading area 300 may be different from each other. Depending on thedeposition process, the deposition area 200 may need to be maintained ina vacuum state.

The mask assembly MA into which the base substrate SUB is loaded orcoupled passes through the deposition chamber CB including thedeposition area 200. The mask assembly MA is transferred (for example,moved from one end of the deposition area 200 to the other) by thetransfer unit TP. The mask assembly MA includes a support member 10, ashutter member 20, and a drive member 30. The support member 10 includesa first opening OP1, through which the deposition materials M1 to M4enter or pass through from the deposition sources S1 to S4, and supportsthe base substrate SUB.

The shutter member 20 is accommodated in the support member 10. Theshutter member 20 includes a second opening OP2 smaller than the firstopening OP1. The deposition materials M1 to M4 passing through the firstopening OP1 are deposited on the base substrate SUB after passingthrough the second opening OP2.

The drive member 30 changes a position of the second opening OP2 withrespect to the base substrate SUB in accordance with the movement of themask assembly MA. For example, the position of the second opening OP2with respect to the base substrate SUB when the mask assembly MA is overthe first deposition source S1 may be different from the position of thesecond opening OP2 with respect to the base substrate SUB when the maskassembly MA is over the fourth deposition source S4.

The transfer unit TP includes a plurality of rollers. The rollers areinstalled on the first sidewall SW1 and the second sidewall SW2. Therollers make contact with the support member 10. The support member 10moves in the first direction D1 according to the rotation of therollers. The rollers may be operated by a motor disposed on the outsideof the deposition chamber CB. The operation of the rollers may becontrolled by turning on and off the motor. The transfer unit TP is notlimited to the rollers or to this implementation of the rollers. Inother embodiments, the transfer unit TP may include different transferdevices, such as a conveyor belt, instead of the rollers.

FIG. 4A is a perspective view showing a mask assembly MA used to test adeposition process according to an exemplary embodiment of the presentinvention. FIG. 4B is an exploded perspective view showing the maskassembly MA of FIG. 4A.

Referring to FIGS. 4A and 4B, the support member 10 includes a bottomportion 10-BP and sidewalls 10-SW. The first opening OP1 is formedthrough the bottom portion 10-BP. The sidewalls 10-SW are bent from thebottom portion 10-BP. The bottom portion 10-BP has a rectangular shapewhen viewed in a plan view. The sidewalls 10-SW are bent from each ofthe four sides of the bottom portion 10-BP having the rectangular shape.The sidewalls 10-SW include vertical portions connected to the foursides of the bottom portion 10-BP and horizontal portions connected tothe vertical portions and contacting the base substrate SUB.

The shutter member 20 is disposed on the bottom portion 10-BP to overlapthe first opening OP1. The shutter member 20 is surrounded by thesidewalls 10-SW and has a rectangular shape. The shutter member 20 has alarger area than the first opening OP1.

The second opening OP2 is elongated in the second direction D2substantially perpendicular to the first direction D1. For instance, thesecond opening OP2 may be a slit having a length in the second directionD2 longer than a width in the first direction D1.

The drive member 30 (see FIG. 3) may be rotated in accordance with themovement of the mask assembly MA. The rotational force of the drivemember 30 is delivered to the shutter member 20 and the shutter member20 moves by the rotational force. A motive power source that causes therotation of the drive member 30 may be, but not limited to, a mechanicalmember, e.g., a motor, friction with an outside member (for example, africtional force), etc.

As shown in FIGS. 4A and 4B, the drive member 30 includes first andsecond rotation members 30-L and 30-R configured to rotate in oppositedirections. The first and second rotation members 30-L and 30-R aredisposed on opposing ones of the sidewalls 10-SW facing each other inthe second direction D2. The present invention is not limited thereto,and in other embodiments, one of the first or second rotation member30-L or 30-R may not be present.

Each of the first and second rotation members 30-L and 30-R includes afirst pinion 30-P1, a second pinion 30-P2, a third pinion 30-P3, a firstrotation axis 30-RA1, and a second rotation axis 30-RA2. The firstpinion 30-P1 receives a motive power from an external source.

The first rotation axis 30-RA1 connects the first pinion 30-P1 to thesecond pinion 30-P2 to transfer the motive power from the first pinion30-P1 to the second pinion 30-P2. The first rotation axes 30-RA1 of thefirst and second rotation members 30-L and 30-R are inserted intothru-holes TH-L and TH-R formed through the sidewalls 10-SW facing eachother in the second direction D2.

The third pinion 30-P3 is coupled to (for example, engaged with) thesecond pinion 30-P2 to receive the motive power from the second pinion30-P2. The third pinion 30-P3 moves the shutter member 20 using themotive power from the second pinion 30-P2. The second rotation axis30-RA2 connected to the third pinion 30-P3 is fixed to the bottomportion 10-BP.

In other embodiments, the first, second, and third pinions 30-P1, 30-P2,and 30-P3 of each of the first and second rotation members 30-L and 30-Rmay be replaced with a discus-shaped rotation member that does not havea sawtooth pattern. According to another embodiment, the third pinion30-P3 of each of the first and second rotation members 30-L and 30-R maybe omitted and include the second pinion 30-P2 that contacts the shuttermember 20. According to another embodiment, the first pinion 30-P1 ofeach of the first and second rotation members 30-L and 30-R may beomitted and the first rotation axis 30-RA1 may be connected by amechanical member, e.g., a motor. In addition, the first and secondrotation members 30-L and 30-R may include at least one pinion. In otherembodiments, the number of the pinions included in the first and secondrotation members 30-L and 30-R may be changed.

The shutter member 20 includes a plurality of side surfaces. Among theside surfaces, two opposite side surfaces facing the second direction D2and a direction opposite to the second direction D2 contact the thirdpinions 30-P3 of the first and second rotation members 30-L and 30-R,respectively. The opposite side surfaces facing the second direction D2and the direction opposite to the second direction D2 may includesawteeth that engage the sawteeth of the third pinions 30-P3.

Due to the engagement between the third pinions 30-P3 and the two sidesurfaces of the shutter member 20, the position of the shutter member 20is changed with respect to the base substrate SUB when a motive power isapplied to the third pinions 30-P3. According to the change of theposition of the shutter member 20, the position of the second openingOP2 is changed with respect to the base substrate SUB. In otherembodiments, the sawteeth of the side surfaces, which face the seconddirection D2 and the direction opposite to the second direction D2, maybe omitted.

According to the rotation of the first pinions 30-P1 of the first andsecond rotation members 30-L and 30-R, the position of the shuttermember 20 is changed. When the first pinion 30-P1 of the first rotationmember 30-L is rotated in a counter-clockwise direction and the firstpinion 30-P1 of the second rotation member 30-R is rotated in aclockwise direction, the shutter member 20 moves in a direction oppositeto the first direction D1.

FIG. 5A is a perspective view showing a mask assembly MA10 used to testa deposition process according to another exemplary embodiment of thepresent invention. FIG. 5B is an exploded perspective view showing themask assembly MA10 of FIG. 5A. The mask assembly MA10 shown in FIGS. 5Aand 5B has a similar configuration as that of the mask assembly MAdescribed with reference to FIGS. 4A and 4B, and thus detaileddescriptions of the same configuration will not be repeated.

Referring to FIGS. 5A and 5B, the mask assembly MA10 further includesfirst and second rail units RP-L and RP-R spaced apart from each otherand disposed on (e.g., located at) the bottom portion 10-BP of thesupport member 10. The first rail RP-L and the second rail RP-R extendin the first direction D1.

In addition, the mask assembly MA10 includes first and second couplingunits (for example, first and second coupling blocks CM-L and CM-R)respectively coupled to the first and second rail units RP-L and RP-Lsuch that the first and second coupling blocks CM-L and CM-R move alongthe first and second rail units RP-L and RP-R, respectively. FIG. 5Bshows two first coupling blocks CM-L and two second coupling blocks CM-Ras an example.

The first coupling block CM-L and the second coupling block CM-R areattached to a lower surface of the shutter member 20. Accordingly, theshutter member 20 stably moves by the first and second coupling blocksCM-L and CM-R respectively coupled to the first and second rails RP-Land RP-R. As a result, the shutter member 20 may more firmly couple toor engage the drive member 30.

FIG. 6A is a perspective view showing a mask assembly MA20 used to testa deposition process according to yet another exemplary embodiment ofthe present invention. FIG. 6B is an exploded perspective view showingthe mask assembly MA20 of FIG. 6A. The mask assembly MA20 shown in FIGS.6A and 6B has a similar configuration as that of the mask assembly MAdescribed with reference to FIGS. 4A and 4B, and thus detaileddescriptions of the same configuration will not be repeated.

Referring to FIGS. 6A and 6B, the mask assembly MA20 includes a supportmember 10, at least one left shutter member 20L and/or right shuttermember 20R, and a drive member 30 (see FIG. 3). The support member 10includes at least one first opening OP1 formed therethrough. As shown inFIG. 6B, the support member 10 includes four first openings OP1.

The mask assembly MA20 includes a plurality of left and right shuttermembers 20L and 20R. For example, the number of left and right shuttermembers 20L and 20R may be the same as the number of first openings OP1.That is, four left and right shutter members 20L and 20R are disposed(or located) corresponding to the four first openings OP1, respectively,as shown in FIG. 6B. The four left and right shutter members 20L and 20Rinclude two left shutter members 20L and two right shutter members 20R.

Each of the left shutter members 20L includes a left rotatable member20-L with a left second opening 20-LOP and a left rotation axis 20-RAL.The left rotation axis 20-RAL is coupled to the left rotatable member20-L to rotate the left rotatable member 20-L.

Each of the right shutter members 20R includes a right rotatable member20-R with a right second opening 20-ROP and a right rotation axis20-RAR. The right rotation axis 20-RAR is coupled to the right rotatablemember 20-R to rotate the right rotatable member 20-R. The left rotationaxis 20-RAL and the right rotation axis 20-RAR are coupled to the bottomportion 10-BP.

The left rotatable member 20-L and the right rotatable member 20-R arerotated in accordance with the movement of the mask assembly MA20. Theleft rotatable member 20-L and the right rotatable member 20-R arerotated in opposite directions to each other. In other embodiments, themask assembly MA20 may include either the left shutter member 20L or theright shutter member 20R.

When the first pinion 30-P1 of the first rotation member 30-L is rotatedin the counter-clockwise direction, the left rotatable member 20-L isrotated in the counter-clockwise direction. When the first pinion 30-P1of the second rotation member 30-R is rotated in the clockwisedirection, the right rotatable member 20-R is rotated in the clockwisedirection. Due to the rotation of the left rotatable member 20-L, theposition of the left second opening 20-LOP is changed with respect tothe base substrate SUB. In addition, the position of the right secondopening 20-ROP is changed above the base substrate SUB in accordancewith the rotation of the right rotatable member 20-R.

FIG. 7 is a first cross-sectional view showing a portion of thedeposition apparatus shown in FIG. 1 according to another exemplaryembodiment of the present invention. FIG. 8 is a second cross-sectionalview showing a portion of the deposition apparatus shown in FIGS. 1 and7. FIG. 9 is a perspective view showing a portion of the depositionapparatus of FIGS. 1 and 7-8 according to an exemplary embodiment of thepresent invention.

In FIGS. 7 to 9, the same reference numerals denote the same elements inFIGS. 1 to 6B, and thus detailed descriptions of the same elements willnot be repeated. In addition, FIGS. 7 to 9 show the mask assembly MA10shown in FIGS. 5A and 5B as an example and the transfer unit TP includesthe rollers.

The mask assembly MA10 moves in the first direction D1 by the rollers TPdisposed on the first and second sidewalls SW1 and SW2. For example, thesupport member 10 of the mask assembly MA10 contacts the rollers TP.Accordingly, when the rollers TP stop their operation, the mask assemblyMA10 may stop moving.

The mask assembly MA10 may stop moving at each of the individualdeposition areas 210 to 240 (see FIG. 1) while the mask assembly MA10passes through the deposition chamber CB. When the mask assembly MA10stops moving, the deposition material is deposited on the base substrateSUB. Accordingly, the deposition materials M1 to M4 are deposited indifferent areas of the base substrate SUB while the mask assembly MA10passes through the deposition chamber CB.

For example, the mask assembly MA10 may stop moving at the firstdeposition source S1. In this case, the position of the second openingOP2 with respect to the base substrate SUB is defined as a firstposition. The first deposition material M1 evaporated from the firstdeposition source S1 is deposited in an area of the base substrate SUBthrough the first opening OP1 and the second opening OP2. The maskassembly MA10 that stops moving at the first deposition source S1 for adeposition time period (for example, a predetermined time period) movesagain in the first direction D1. In this case, the shutter member 20moves in the opposite direction to the first direction D1.

The mask assembly MA10 stops moving at the second deposition source S2.The position of the second opening OP2 with respect to the basesubstrate SUB is defined as a second position. The second position isdifferent from the first position because the second opening OP2 hasmoved in the opposite direction to the first direction D1 (that is, awayfrom the first position) since the second opening OP2 was in the firstposition. That is, to reach the second position, the second opening OP2had to move further in the direction opposite to the first direction D1than the second opening OP2 moved to reach the first position.Accordingly, the second deposition material M2 evaporated from thesecond deposition source S2 is deposited through the first opening OP1and the second opening OP2 in an area of the base substrate SUB that isdifferent from the area in which the first deposition material M1 isdeposited.

Then, the mask assembly MA10 stops moving at each of the third andfourth deposition sources S3 and S4. When the mask assembly MA10completely passes through the deposition area 200 of the depositionchamber CB, the first to fourth deposition materials M1 to M4 aredeposited in different areas on the base substrate SUB. After that, thethickness and uniformity of each of the first to fourth depositionmaterials M1 to M4 deposited on the base substrate SUB are measured. Themeasured thickness and uniformity are compared to the referencethickness and uniformity values. Accordingly, the deposition process ofthe deposition chamber CB is tested to see if it is appropriate formanufacturing the display apparatus (or other semiconductor device)according to the compared results.

As shown in FIGS. 7 to 9, the deposition apparatus according to thepresent exemplary embodiment includes a plurality of transfer racks TR1to TR4 disposed on each of the first and second sidewalls SW1 and SW2 ofthe deposition chamber CB. The transfer racks TR1 to TR4 are located inthe deposition area 200.

FIGS. 7-9 show the transfer racks TR1 to TR4 disposed on the firstsidewall SW1 and the first pinion 30-P1 (see FIG. 5B) of the firstrotation member 30-L. The transfer racks TR1 to TR4 are spaced apartfrom each other. The transfer racks TR1 to TR4 are disposed tocorrespond to the deposition sources S1 to S4 in a one-to-onecorrespondence. The transfer racks TR1 to TR4 are disposed closer to theloading area 100 than the deposition sources S1 to S4 in the firstdirection D1. In another embodiment of the present invention, thetransfer racks correspond to the partition walls B1 to B3 (or spacesbetween the deposition sources S1 to S4) in a one-to-one correspondence.That is, there is no transfer rack before the first deposition sourceS1.

When the mask assembly MA10 moves in the first direction D1, the firstpinion 30-P1 of the first rotation member 30-L sequentially engages thetransfer racks TR1 to TR4. For instance, when the first pinion 30-P1finishes engaging the first transfer rack TR1, the second opening OP2 islocated at the first position, and the second opening OP2 is located atthe second position when the first pinion 30-P1 finishes engaging thesecond transfer rack TR2. As shown in FIG. 9, when the first pinion30-P1 engages the second transfer rack TR2, the shutter member 20 moveswith respect to the base substrate SUB in the opposite direction to thefirst direction D1 by a length corresponding to the length of the secondtransfer rack TR2.

In another embodiment, the left rotatable member 20-L of the maskassembly MA20 shown in FIGS. 6A and 6B may be rotated in thecounter-clockwise direction by the engagement of the first pinion 30-P1of the first rotation member 30-L and the transfer racks TR1 to TR4disposed on the first sidewall SW1. In addition, the second rotatablemember 20-R may be rotated in the clockwise direction by the engagementof the first pinion 30-P1 of the second rotation member 30-R and thetransfer racks TR1 to TR4 disposed on the second sidewall SW2.

FIG. 10 is a perspective view showing a portion of the depositionapparatus of FIGS. 1 and 7-8 together with a mask assembly MA30according to another exemplary embodiment of the present invention. FIG.11 is an enlarged perspective view showing a portion of the depositionapparatus including a portion of the mask assembly MA30 shown in FIG.10. In FIGS. 10 and 11, the same reference numerals denote the sameelements in FIGS. 1 to 9, and thus detailed descriptions of the sameelements will not be repeated.

Referring to FIGS. 10 and 11, a deposition apparatus includes aplurality of magnetic transfer members TM1 to TM3 disposed on thesidewalls SW1 and SW2 of the deposition chamber CB. Each of the magnetictransfer members TM1 to TM3 includes N-polar portions and S-polarportions, which are alternately arranged with each other. Each of themagnetic transfer members TM1 to TM3 extends in the first direction D1.The magnetic transfer members TM1 to TM3 are used instead of thetransfer racks TR1 to TR4 shown in FIG. 9.

As shown in FIGS. 10 and 11, each of the first and second rotationmembers 30-L and 30-R of the mask assembly MA30 includes a discus-shapedmagnetic member 30-M1. The discus-shaped magnetic member 30-M1 alsoincludes N-polar portions and S-polar portions, which are alternatelyarranged with each other along its circumference. The first pinion 30-P1(see FIG. 4B) may thus be replaced with the discus-shaped magneticmember 30-M1.

When the mask assembly MA30 moves in the first direction D1, thediscus-shaped magnetic member 30-M1 moves proximate to each of themagnetic transfer members TM1 to TM3. The discus-shaped magnetic member30-M1 may be spaced apart from the magnetic transfer members TM1 to TM3.The discus-shaped magnetic member 30-M1 is rotated by a magnetic force,e.g., an attractive and/or a repulsive force, between the N-polarportions and the S-polar portions of the discus-shaped magnetic member30-M1 and the magnetic transfer members TM1 to TM3.

For instance, when the discus-shaped magnetic member 30-M1 passesthrough the second magnetic transfer member TM2, the shutter member 20moves in the opposite direction to the first direction D1 by a lengthcorresponding to a length of the second magnetic transfer member TM2.According to the present exemplary embodiment, since friction does notoccur between the discus-shaped magnetic member 30-M1 and the magnetictransfer members TM1 to TM3, foreign substances are not generated in thedeposition area 200. In other embodiments, the second pinion 30-P2 andthe third pinion 30-P3 may also be replaced with the discus-shapedmagnetic member.

FIG. 12 is a plan view showing a deposition apparatus according toanother exemplary embodiment of the present invention. FIG. 13 is afirst cross-sectional view showing a portion of the deposition apparatusshown in FIG. 12. FIG. 14 is a second cross-sectional view showing aportion of the deposition apparatus shown in FIGS. 12-13. In FIGS. 12 to14, the same reference numerals denote the same elements in FIGS. 1 to11, and thus detailed descriptions of the same elements will not berepeated.

Referring to FIGS. 12 to 14, the deposition apparatus includes adeposition chamber CB, a plurality of deposition sources S1 to S4, amask assembly MA, and a transfer unit TP (see FIG. 2). The depositionapparatus further includes a return chamber RCB and a return unit RTP.The return unit RTP is disposed in the return chamber RCB to return themask assembly MA to the loading area 100 from the unloading area 300.The return unit RTP may be configured, for example, to include aconveyor belt or a set of rollers (or some other transfer device) aswith the transfer unit TP. The return unit RTP moves the mask assemblyMA from which the base substrate SUB (see FIG. 3) is separated ordecoupled.

The return chamber RCB includes a first sidewall RSW1, a second sidewallRSW2 facing the first sidewall RSW1 in the second direction D2, a bottomportion RBP, and a ceiling portion RCP. The return unit RTP may bedisposed on the first sidewall RSW1 and the second sidewall RSW2.

The return chamber RCB may further include a return rack RTR disposed onat least one of the first or second sidewalls RSW1 or RSW2 of the returnchamber RCB. The return rack RTR may also be disposed on each of thefirst and second sidewalls RSW1 and RSW2.

The mask assembly MA enters (for example, is coupled to or put under thecontrol of) the return unit RTP at an opposite end of the depositionchamber CB (for example, corresponding to the unloading area 300) towhere the mask assembly MA entered (for example, was coupled to or putunder the control of) the transfer unit TP (for example, correspondingto the loading area 100). In order to return the position of the shuttermember 20 to the position before the mask assembly MA entered thetransfer unit TP, each of the return racks RTR may have a length equalto a sum of the lengths of the transfer racks TR1 to TR4. When the maskassembly MA moves in the opposite direction to the first direction D1,the pinions 30-P1 and 30-P2 (see FIG. 4B) of the drive member 30 (forexample, first rotation member 30-L or second rotation member 30-R)respectively engage the return racks RTR disposed on the first andsecond sidewalls RSW1 and RSW2.

When the mask assembly MA completely passes through the return rack RTR,the shutter member 20 moves in the first direction D1 with respect tothe mask assembly MA by a length corresponding to the length of thereturn rack RTR. That is, the position of the shutter member 20completely passing through the return rack RTR returns to its originalposition before the mask assembly MA entered the transfer unit TP.

According to another embodiment, when each of the first and secondrotation members 30-L and 30-R includes the discus-shaped magneticmember 30-M1 (refer to FIGS. 10 and 11), the return rack RTR may bereplaced with a magnetic return member, in which N-polar portions andS-polar portions are alternately arranged with each other.

Although the exemplary embodiments of the present invention have beendescribed, it is understood that the present invention should not belimited to these exemplary embodiments but various changes andmodifications can be made by one ordinary skilled in the art within thespirit and scope of the present invention as hereinafter claimed in theaccompanying claims, and their equivalents.

What is claimed is:
 1. A mask assembly for testing a deposition process,comprising: a support member having a first opening configured to allowdeposition materials to pass through while supporting a base substrateon which the passed-through deposition materials are deposited while themask assembly moves in a first direction; a shutter member accommodatedin the support member and having a second opening smaller than the firstopening; and a drive member configured to move the shutter member inaccordance with the movement of the mask assembly to change a positionof the second opening with respect to the base substrate.
 2. The maskassembly of claim 1, wherein the support member comprises: a bottomportion having the first opening; and a sidewall bent from the bottomportion to support the base substrate.
 3. The mask assembly of claim 2,wherein the shutter member is configured to move with respect to thebase substrate in a direction opposite to the first direction inaccordance with the movement of the mask assembly.
 4. The mask assemblyof claim 3, wherein the second opening extends in a second directionsubstantially perpendicular to the first direction.
 5. The mask assemblyof claim 2, wherein the shutter member has a larger area than the firstopening and is located on the bottom portion.
 6. The mask assembly ofclaim 2, further comprising: a rail unit located on the bottom portion;and a coupling unit coupled to the shutter member and inserted into therail unit to allow the shutter member to move along the rail unit. 7.The mask assembly of claim 1, wherein the drive member is configured torotate in accordance with the movement of the mask assembly, and theshutter member is configured to move in accordance with the rotation ofthe drive member.
 8. The mask assembly of claim 7, wherein the drivemember comprises a first pinion configured to rotate by a frictionalforce.
 9. The mask assembly of claim 8, wherein the drive member furthercomprises a second pinion configured to receive a motive power from thefirst pinion and to make contact with a side surface of the shuttermember.
 10. The mask assembly of claim 9, wherein the shutter membercomprises sawteeth on the side surface of the shutter member andconfigured to engage sawteeth of the second pinion.
 11. The maskassembly of claim 7, wherein the drive member comprises an N-polarportion and an S-polar portion that are alternately arranged, and isconfigured to rotate by a magnetic force.
 12. A mask assembly fortesting a deposition process, comprising: a support member having afirst opening configured to pass through deposition materials whilesupporting a base substrate on which the passed-through depositionmaterials are deposited while the mask assembly moves; a shutter memberaccommodated in the support member and comprising a rotatable memberhaving a second opening smaller than the first opening; and a drivemember configured to rotate the rotatable member in accordance with themovement of the mask assembly to change a position of the second openingwith respect to the base substrate.
 13. The mask assembly of claim 12,wherein the support member comprises: a bottom portion having the firstopening; and a sidewall bent from the bottom portion to support the basesubstrate.
 14. The mask assembly of claim 12, wherein the shutter memberfurther comprises a rotation axis coupled to the rotatable member torotate the rotatable member.
 15. The mask assembly of claim 14, whereinthe first opening comprises a left first opening and a right firstopening, and the shutter member comprises a left shutter memberoverlapping the left first opening and a right shutter memberoverlapping the right first opening.
 16. The mask assembly of claim 15,wherein the drive member comprises a first drive member configured torotate in a first direction and a second drive member configured torotate in a second direction that is opposite to the first direction inaccordance with the movement of the support member, the position of thesecond opening of the rotatable member of the left shutter member withrespect to the base substrate is configured to change by the rotation ofthe first drive member, and the position of the second opening of therotatable member of the right shutter member with respect to the basesubstrate is configured to change by the rotation of the second drivemember.
 17. The mask assembly of claim 16, wherein each of the firstdrive member and the second drive member comprises a first pinionconfigured to rotate by a frictional force.
 18. The mask assembly ofclaim 17, wherein each of the first and second drive members furthercomprises a second pinion configured to receive a motive power from thefirst pinion and to make contact with a side surface of the shuttermember.
 19. The mask assembly of claim 16, wherein each of the first andsecond drive members comprises a discus-shaped magnetic membercomprising an N-polar portion and an S-polar portion that arealternately arranged, and the magnetic member is configured to rotate bya magnetic force.
 20. A deposition apparatus comprising: a plurality ofdeposition sources configured to deposit deposition materials; adeposition chamber accommodating the deposition sources; a mask assemblyfor testing a deposition process, the mask assembly being configured tocouple to a base substrate while moving through the deposition chamberwhile the deposition sources deposit the deposition materials on thebase substrate; and a transfer unit configured to move the mask assemblythrough the deposition chamber, wherein the mask assembly comprises: asupport member having a first opening configured to allow the depositionmaterials to pass through while supporting the base substrate on whichthe passed-through deposition materials are deposited; a shutter memberaccommodated in the support member and having a second opening smallerthan the first opening; and a drive member configured to change aposition of the second opening with respect to the base substrate inaccordance with the movement of the mask assembly.
 21. The depositionapparatus of claim 20, wherein the transfer unit comprises a pluralityof rollers configured to move the mask assembly through the depositionchamber.
 22. The deposition apparatus of claim 20, wherein the drivemember is configured to rotate in accordance with the movement of themask assembly, and the position of the second opening is configured tochange by the rotation of the drive member.
 23. The deposition apparatusof claim 22, wherein the deposition chamber comprises: a loading areaconfigured to couple the base substrate to the mask assembly; adeposition area in which the deposition sources are accommodated; and anunloading area configured to decouple the base substrate from the maskassembly.
 24. The deposition apparatus of claim 23, wherein the drivemember comprises a plurality of pinions, and one of the pinions isconfigured to contact a side surface of the shutter member to change theposition of the second opening with respect to the base substrate. 25.The deposition apparatus of claim 24, wherein the deposition chambercomprises a plurality of transfer racks on a sidewall of the depositionarea to correspond to the deposition sources or to spaces between thedeposition sources.
 26. The deposition apparatus of claim 25, whereinanother one of the pinions is configured to contact the transfer racksto change the position of the second opening with respect to the basesubstrate.
 27. The deposition apparatus of claim 26, further comprising:a return unit configured to return the mask assembly to the loading areafrom the unloading area; and a return chamber accommodating the returnunit.
 28. The deposition apparatus of claim 27, wherein the returnchamber comprises a return rack on a sidewall of the return chamber. 29.The deposition apparatus of claim 23, wherein the drive member comprisesa discus-shaped magnetic member comprising an N-polar portion and anS-polar portion that are alternately arranged, and the depositionchamber comprises a plurality of magnetic transfer members, eachcomprising an N-polar portion and an S-polar portion that arealternately arranged, on a sidewall of the deposition area to correspondto the deposition sources.
 30. The deposition apparatus of claim 23,wherein the support member comprises: a bottom portion having the firstopening; and a sidewall bent from the bottom portion to support the basesubstrate.
 31. The deposition apparatus of claim 30, wherein the shuttermember is configured to move with respect to the base substrate in adirection opposite to a direction in which the mask assembly moves, inaccordance with the movement of the mask assembly.
 32. The depositionapparatus of claim 30, wherein the shutter member comprises a rotatablemember configured to rotate by the movement of the mask assembly.
 33. Atesting method for a deposition process using a mask assembly, thetesting method comprising: entering the mask assembly into a depositionarea of a deposition chamber accommodating a plurality of depositionsources, the mask assembly comprising a support member supporting a basesubstrate and a shutter member having an opening; depositing arespective plurality of deposition materials from the plurality ofdeposition sources onto the base substrate; moving the mask assemblythrough the deposition area; and changing a position of the opening ofthe shutter member with respect to the base substrate in accordance withthe movement of the mask assembly.
 34. The testing method of claim 33,further comprising: exiting the mask assembly from the deposition area;and returning the mask assembly to an entrance of the deposition areafrom an exit of the deposition area.
 35. The testing method of claim 33,wherein the changing of the position of the opening of the shuttermember comprises moving the shutter member with respect to the basesubstrate in a direction opposite to a direction in which the maskassembly moves.
 36. The testing method of claim 33, wherein the changingof the position of the opening of the shutter member comprises rotatingthe shutter member in accordance with the movement of the mask assembly.37. The testing method of claim 33, wherein the plurality of depositionmaterials comprises a corresponding plurality of different depositionmaterials.